Specifications

The following information is a summary of the features and specifications of the server. Depending on the model, some features might not be available, or some specifications might not apply.

Table 1. Server specifications
Specification Description

Dimension

  • 1U

  • Height: 43.0 mm (1.7 inches)

  • Width:
    • With rack latches: 482.0 mm (19.0 inches)

    • Without rack latches: 434.4 mm (17.1 inches)

  • Depth: 778.3 mm (30.7 inches)

    Note: The depth is measured with rack latches and power supply installed, but without security bezel installed.

Weight

Up to 19.0 kg (41.9 lb)

Processor (depending on the model)

  • Up to two Intel® Xeon® Scalable Processors

    • Designed for Land Grid Array (LGA) 3647 socket

    • Up to 28 cores

    • Thermal Design Power (TDP): up to 205 watts
  • Up to two Jintide® processors for Chinese Mainland only.

For more important information about the processor, refer to Important information for system board, processor, and heat sink.

For a list of supported processors, see: the Lenovo ServerProven website
Note: For Jintide processors, only C08101, C10201, C12301, C14501, and C16401 models are supported for Chinese Mainland.

Memory

For 1st Generation Intel Xeon Scalable Processor (Intel Xeon SP Gen 1) or Jintide processors:
  • Slots: 24 memory module slots

  • Minimum: 8 GB

  • Maximum:

    • 768 GB using registered memory modules (RDIMMs)

    • 1.5 TB using load-reduced memory modules (LRDIMMs)

    • 3 TB using three-dimensional stack registered memory modules (3DS RDIMMs)

  • Type:

    • or
    • TruDDR4 2666, single-rank/dual-rank, 8 GB/16 GB/32 GB RDIMM

    • TruDDR4 2666, quad-rank, 64 GB LRDIMM

    • TruDDR4 2666, octa-rank, 128 GB 3DS RDIMM

For 2nd Generation Intel Xeon Scalable Processor (Intel Xeon SP Gen 2):
  • Slots: 24 memory module slots

  • Minimum: 8 GB

  • Maximum:

    • 1.5 TB using registered memory modules (RDIMMs)

    • 3 TB using three-dimensional stack registered memory modules (3DS RDIMMs)

    • 6 TB using DC Persistent Memory Module (DCPMM) and RDIMMs/3DS RDIMMs in Memory Mode

  • Type: (depending on the model)

    • TruDDR4 2666, single-rank/dual-rank, 16 GB/32 GB RDIMMs

    • TruDDR4 2933, single-rank/dual-rank, 8 GB/16 GB/32 GB/64 GB RDIMMs

    • TruDDR4 2666, quad-rank, 64 GB 3DS RDIMMs

    • TruDDR4 2933, quad-rank, 128 GB 3DS RDIMMs
    • 128 GB/256 GB/512 GB DC Persistent Memory Module
DCPMM installation rules:
  • DCPMMs are not supported if any GPU is installed.

Note:
  • Operating speed and total memory capacity depend on the processor model and UEFI settings.

  • Rear drive assembly and 256 GB/512 GB DCPMM are not installed at the same time.

For a list of supported memory, see the Lenovo ServerProven Web site: https://static.lenovo.com/us/en/serverproven/index.shtml.

Internal drives

  • Up to two M.2 drives

  • Up to four 3.5-inch hot-swap SAS/SATA drives

  • Up to four 3.5-inch hot-swap SAS/SATA/NVMe drives

  • Up to eight 2.5-inch hot-swap SAS/SATA drives

  • Up to ten 2.5-inch hot-swap SAS/SATA/NVMe drives (NVMe drives are supported only in drive bays 6–9)

  • Up to ten 2.5-inch hot-swap NVMe drives

  • Up to two 2.5-inch hot-swap SAS/SATA drives in the rear (the processor TDP should be less than or equal to 125 watts)
    Note:
    • NVMe drives means Non-Volatile Memory express drives.

    • Only use M.2 drives provided by Lenovo.

    • The backplane for ten 2.5-inch hot-swap NVMe drives is supported only when the following configuration requirements are met:
      • Intel Xeon 6144, 6146, 6154, 6240C, 6240Y, 6242R, 6244, 6246, 6246R, 6248R, 6252N, 6254, 6258R, 8168, 8171M, 8180, 8180M, 8268, 8270, 8280, 8280L, and 8280M processors are not installed.

      • The power of the hot-swap power supply is 1100 watts.

      • Rear hot-swap drive assembly is not installed.

      • GPU is not installed.

      • NVMe PCIe flash adapter is not installed.

      • 256 GB/512 GB DCPMM

        is not installed.

PCIe slots

Depending on the model, your server supports up to three PCIe slots in the rear. For detailed information, see Rear view.

Note: For ThinkSystem Mellanox ConnectX-6 HDR/200GbE QSFP56 1-port PCIe adapter, when AOC cable and transceiver are installed, the system operating temperature must be less than or equal to 30°C; when other DAC cable is installed, the system operating temperature must be less than or equal to 35°C.

Graphics processing unit (GPU)

Your server supports the following GPUs:
  • One NVIDIA Quadro P2000 PCIe Active GPU (full-height, 3/4 length)

  • One NVIDIA Quadro P2200 PCIe Active GPU (full-height, 3/4 length)

  • One NVIDIA Quadro P4000 PCIe Active GPU (full-height, full-length)

  • One NVIDIA Quadro RTX4000 PCIe Active GPU (full-height, full-length)

  • Up to two NVIDIA Tesla P4 8GB PCIe Passive GPU (low-profile)

  • Up to two NVIDIA Tesla T4 8GB PCIe Passive GPU (low-profile)

  • Up to three NVIDIA Quadro P600 2GB PCIe Active GPU (low-profile)

  • Up to three NVIDIA Quadro P620 PCIe Active GPU (low-profile)

Location for installing GPUs:
  • Install P2000/P2200/P4000/RTX4000 GPU only in the full-height PCIe slot 2.

  • Install the first P4/T4 GPU in PCIe slot 3 and install the second P4/T4 GPU in PCIe slot 1.

  • Install the first P600 GPU in PCIe slot 3, install the second P600 GPU in PCIe slot 1, and install the third P600 GPU in PCIe slot 2.

  • Install the first P620 GPU in PCIe slot 3, install the second P620 GPU in PCIe slot 1, and install the third P620 GPU in PCIe slot 2.

GPU installation requirements:
  • P2000/P2200 GPU is supported only when the following configuration requirements are met:
    • Processor TDP is less than or equal to 140 watts.

    • No RAID adapter is installed on the RAID adapter slot on the system board. If you want to install a RAID adapter, install it in PCIe slot 1.

    • The power of the hot-swap power supply is 750 watts or 1100 watts.

    • The backplane for ten 2.5-inch NVMe drives is not installed.

    • Rear hot-swap drive assembly is not installed.

    • No system fan is failed.

  • P4000/RTX4000 GPU is supported only when the following configuration requirements are met:
    • Intel Xeon 6144, 6146, 6246, or 6252N processor is not installed and processor TDP is less than or equal to 165 watts.

    • No RAID adapter is installed on the RAID adapter slot on the system board. If you want to install a RAID adapter, install it in PCIe slot 1.

    • The power of the hot-swap power supply is 750 watts or 1100 watts.

    • The backplane for ten 2.5-inch NVMe drives is not installed.

    • Rear hot-swap drive assembly is not installed.

    • No system fan is failed.

  • P4/T4 GPU is supported only when the following configuration requirements are met:
    • Intel Xeon 6144, 6146, 6246, or 6252N processor is not installed and processor TDP is less than or equal to 165 watts.

    • The backplane for ten 2.5-inch NVMe drives is not installed.

    • Rear hot-swap drive assembly is not installed.

    • If one P4/T4 GPU is installed, the power of the hot-swap power supply must be 750 watts or 1100 watts.

    • If two P4/T4 GPUs are installed, the power of the hot-swap power supply must be 1100 watts

    • If one P4/T4 GPU is installed in PCIe slot 3, the system operating temperature must be less than or equal to 35 °C to support fan rotor redundancy.

    • If two P4/T4 GPUs are installed, one in PCIe slot 1 and one in PCIe slot 3, the system operating temperature must be less than or equal to 30 °C to support fan rotor redundancy.

  • P600 GPU is supported only when the following configuration requirements are met:
    • Intel Xeon 6144, 6146, 6246, or 6252N processor is not installed and processor TDP is less than or equal to 165 watts.

    • If one or two P600 GPUs are installed, the power of the hot-swap power supply is 750 watts or 1100 watts; if three P600 GPUs are installed, the power of the hot-swap power supply is 1100 watts.

    • The backplane for ten 2.5-inch NVMe drives is not installed.

    • Rear hot-swap drive assembly is not installed.

    • No system fan is failed.

  • P620 GPU is supported only when the following configuration requirements are met:
    • Intel Xeon 6144, 6146, 6246, or 6252N processor is not installed and processor TDP is less than or equal to 165 watts.

    • If one or two P620 GPUs are installed, the power of the hot-swap power supply is 750 watts or 1100 watts; if three P620 GPUs are installed, the power of the hot-swap power supply is 1100 watts.

    • The backplane for ten 2.5-inch NVMe drives is not installed.

    • Rear hot-swap drive assembly is not installed.

    • No system fan is failed.

Input/Output (I/O) features

  • Front panel:
    • One VGA connector (available on some models)

    • One XClarity Controller USB 2.0 connector

    • One USB 3.0 connector

  • Rear panel:
    • One VGA connector

    • Two USB 3.0 connectors

    • One XClarity Controller network connector

    • Two or four Ethernet connectors on the LOM adapter (available on some models)

    • One serial port (available on some models)

RAID adapters (depending on the model)

  • A RAID 530-8i SAS/SATA adapter that supports JBOD mode and RAID levels 0, 1, 5, 10, and 50

  • A RAID 730-8i 1G Cache SAS/SATA adapter that supports JBOD mode and RAID levels 0, 1, 5, 10, and 50 (for Chinese Mainland only)

  • A RAID 730-8i 2G Cache SAS/SATA adapter that supports JBOD mode and RAID levels 0, 1, 5, 6, 10, 50, and 60

  • A RAID 930-8i or 930-16i SAS/SATA adapter that supports JBOD mode and RAID levels 0, 1, 5, 6, 10, 50, and 60

  • A RAID 930-8e SAS/SATA adapter that supports JBOD mode and RAID levels 0, 1, 5, 6, 10, 50, and 60

Note:
  • RAID 530-8i SAS/SATA adapter, RAID 730-8i SAS/SATA adapter, and RAID 930- 8i SAS/SATA adapter cannot be mixed.
  • A RAID super capacitor module must be installed if the RAID 930-8i or 930-16i SAS/SATA adapter or RAID 930-8e SAS/SATA adapter is installed.

System fans

  • One processor: five dual-rotor hot-swap fans (including one redundant fan rotor)

  • Two processors: seven dual-rotor hot-swap fans (including one redundant fan rotor)

Note:
  • For server models installed with Intel Xeon 6144, 6146, 6154, 6240C, 6240Y, 6242R, 6244, 6246, 6246R, 6248R, 6252N, 6254, 6258R, 8168, 8171M, 8180, 8180M, 8268, 8270, 8280, 8280L, and 8280M processors, fan rotor redundancy is not supported. If one fan rotor fails, the server performance will be degraded.

  • If your server comes with only one processor, five system fans (fan 1 to fan 5) are adequate to provide proper cooling. However, you must keep the locations for fan 6 and fan 7 occupied by a fan filler to ensure proper airflow.

  • When 256 GB/512 GB DCPMM is installed, and the ambient temperature is more than 30°C, fan rotor redundancy is not supported.

Power supplies

CAUTION:
  1. 240 V dc input (input range: 180-300 V dc) is ONLY supported in Chinese Mainland.

  2. Power supplies with 240 V dc are not hot-swappable. To remove the power cord, ensure you have turned off the server or disconnected the dc power sources at the breaker panel.

  3. In order for the ThinkSystem products to operate error free in both a DC or AC electrical environment, a TN-S earthing system which complies to 60364-1 IEC 2005 standard has to be present or installed.

One or two hot-swap power supplies for redundancy support
  • 550-watt ac 80 PLUS Platinum

  • 750-watt ac 80 PLUS Platinum

  • 750-watt ac 80 PLUS Titanium

  • 1100-watt ac 80 PLUS Platinum

Minimal configuration for debugging

  • One processor in processor socket 1

  • One memory module in slot 5

  • One power supply

  • One HDD drive or one M.2 drive (if OS is needed for debugging)

  • Five system fans (fan 1 to fan 5)

Acoustical noise emissions

  • Sound power levels, idle

    • 4.9 bels, minimum

    • 5.0 bels, typical

    • 5.8 bels, maximum

  • Sound power levels, operating

    • 5.3 bels, minimum

    • 6.1 bels, typical

    • 6.2 bels, maximum

Note:
  • These sound power levels are measured in controlled acoustical environments according to procedures specified by ISO 7779 and are reported in accordance with ISO 9296.

  • The declared acoustic noise levels are based on specified configurations, which may change slightly depending on configuration/conditions.

Electrical input

  • Sine-wave input (50–60 Hz) required

  • Input voltage low range:

    • Minimum: 100 V ac

    • Maximum: 127 V ac

  • Input voltage high range:

    • Minimum: 200 V ac

    • Maximum: 240 V ac

Note: For server models with 750-watt ac 80 PLUS Titanium power supplies, 100–127 V ac input voltage is not supported.
CAUTION:
240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY. Power supply with 240 V dc input cannot support hot plugging power cord function. Before removing the power supply with dc input, please turn off server or disconnect dc power sources at the breaker panel or by turning off the power source. Then, remove the power cord.

Environment

The server is supported in the following environment:
  • Air temperature:

    • Operating:
      • ASHRAE class A2: 10–35°C (50–95°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 300 m (984 ft) of altitude increase.

      • ASHRAE class A3: 5–40°C (41–104°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 175 m (574 ft) of altitude increase.

      • ASHRAE class A4: 5–45°C (41–113°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 125 m (410 ft) of altitude increase.

    • Server off: 5–45°C (41–113°F)

    • Shipping or storage: -40–60°C (-40–140°F)

  • Maximum altitude: 3050 m (10 000 ft)

  • Relative humidity (non-condensing):

    • Operating:
      • ASHRAE class A2: 8%–80%; maximum dew point: 21°C (70°F)

      • ASHRAE class A3: 8%–85%; maximum dew point: 24°C (75°F)

      • ASHRAE class A4: 8%–90%; maximum dew point: 24°C (75°F)

    • Shipping or storage: 8%–90%

  • Particulate contamination
    Attention: Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.
Note: Your server complies with ASHRAE class A2 specifications. The server performance might be impacted when the system operating temperature is outside the ASHRAE A2 specifications. Depending on the hardware configuration, some server models comply with ASHRAE class A3 and class A4 specifications. To comply with ASHRAE class A3 and class A4 specifications, the server models must meet the following hardware configuration requirements at the same time:
  • Two power supplies are installed.

  • NVMe drive is not installed.

  • NVMe PCIe flash adapter is not installed.

  • P2000 GPU is not installed.

  • P2200 GPU is not installed.

  • P4000 GPU is not installed.

  • RTX4000 GPU is not installed.

  • No P4 GPU is installed in PCIe slot 1.

  • No T4 GPU is installed in PCIe slot 1.

  • No P600 GPU is installed in PCIe slot 2.

  • No P620 GPU is installed in PCIe slot 2.

  • Innova-2 FPGA Smart NIC active GPU is not installed.

  • ThinkSystem Mellanox ConnectX-6 100 Gbs 1P/2P PCIe adapter is not installed.

  • ThinkSystem Mellanox ConnectX-6 HDR/200GbE QSFP56 1-port PCIe adapter is not installed.

  • For server models with 2.5-inch drive bays, the RAID super capacitor module cannot be installed on the bottom of the air baffle, but only can be installed on the chassis.

  • The backplane for ten 2.5-inch NVMe drives is not installed.

  • The following processors are not installed:
    • Processors with TDP higher than or equal to 150 watts

    • Intel Xeon 4112, 5122, 6126, 6128, 6132, 6134, 6134M, and 8156 processors

Important information about EU ecodesign requirements

To meet the EU ecodesign requirements for energy-related products (ErP) Lot 9, your server must meet the following requirements:
  • Minimum memory: 16 GB

  • If your server is configured with one processor, Intel Xeon 3104 is not supported.

Important information for system board, processor, and heat sink

There are two types of system board for your server:
  • Left: System board with large lift handle 1

  • Right: System board with small lift handle 2

Figure 1. Two types of system board
Two types of system board
There are two shape types of heat sink for your server:
  • Left: Small-size heat sink

  • Right: Large-size heat sink

Figure 2. Two types of heat sink
Two types of heat sink
The following table lists the important information for the system board, heat sink, and processor.

System board installed

Heat sink installed

Important information

System board with large lift handle or system board with small lift handle

Small size heat sink

For server models installed with Intel Xeon 6144, 6146, 6154, 6240C, 6240Y, 6242R, 6244, 6246, 6246R, 6248R, 6252N, 6254, 6258R, 8168, 8171M, 8180, 8180M, 8268, 8270, 8280, 8280L, and 8280M processors, the following parts are not supported:
  • Front backplane and front hot-swap SAS/SATA/NVMe drives

  • Rear hot-swap drive assembly

  • RAID super capacitor module on the bottom of the air baffle

  • NVMe PCIe flash adapter

  • GPU

System board with small lift handle

Large size heat sink

  • For server models installed with large size heat sink, the air baffle and the RAID super capacitor module on the bottom of the air baffle are not supported.

  • For server models installed with Intel Xeon 6144, 6146, 6244, 6246, 6252N, 8168, 8171M, 8180, 8180M, 8268, 8270, 8280, 8280L, and 8280M processors, ensure that the following configuration requirements are met:
    • The backplane for ten 2.5-inch NVMe drives is not installed.

    • No system fan is failed.

    • Rear hot-swap drive assembly is not installed.

    • NVMe PCIe flash adapter is not installed.

    • GPU is not installed.

  • For server models installed with the backplane for ten 2.5-inch SAS/SATA/NVMe drives, Intel Xeon 6154, 6240C, 6240Y, 6242R, 6246R, 6248R, 6254, and 6258R, processor is supported with the condition that the following configuration requirements are met:
    • No system fan is failed.

    • Only four SAS/SATA/NVMe drives are installed in drive bays 6–9.

    • Rear hot-swap drive assembly is not installed.

    • NVMe PCIe flash adapter is not installed.

    • GPU is not installed.

    Figure 3. Front view of server models installed with Intel Xeon 6154, 6254 and 6240Y processor
    Front view of server models installed with Intel Xeon 6154, 6254, and 6240Y processor