Enclosure specifications

Features and specifications of the enclosure.

Table 1. Enclosure specifications
Specification Description
PCI expansion slots (depending on the enclosure model)
  • PCIe 3.0 x8 shuttle:
    • Supports up to eight low-profile PCIe 3.0 x8 adapters

      One node supports up to two low-profile PCIe 3.0 x8 adapters from processor 1

  • PCIe 3.0 x16 shuttle:

    • Supports up to four low-profile PCIe 3.0 x16 adapters

      One node supports one low-profile PCIe 3.0 x16 adapters from processor 1

      Note:
      1. PCIe 3.0 x16 shuttle supports PCIe cassettes that can be installed and removed without removing the shuttle from the enclosure.

      2. Ensure to power off the node before unseating the PCIe cassette from the shuttle.

Hot-swap fans
  • Three 60x60x56mm fans

  • Two 80x80x80mm fans

Note: Access these fans from the top of the enclosure (see Remove the fan cover).
Power supply (depending on the model) Supports up to two hot-swap power supplies for redundancy support. (Except for the application of 240V DC applied through C14 input connect)
  • 1100-watt ac power supply
  • 1600-watt ac power supply
  • 2000-watt ac power supply
Important: Power supplies and redundant power supplies in the enclosure must be with the same power rating, wattage or level.
System Management Module (SMM)
  • Hot-swappable

  • Equipped with ASPEED controller

  • Offers RJ45 port for management of nodes and SMM over 1G Ethernet

Ethernet I/O ports Access to a pair of on-board 10Gb connections through two types of optional enclosure level EIOM cards.
  • Two optional EIOM cards:
    • 10Gb 8-port EIOM SFP+

    • 10Gb 8-port EIOM Base-T (RJ45)

  • Minimum networking speed requirement for the EIOM card: 1Gbps
Note:
  1. The EIOM card is installed in the enclosure and it provides direct access to LAN functions provided by each node.

  2. iSCSI external storage devices are not supported when shared PCIe dual adapters are installed.

Size 2U enclosure
  • Height: 87.0 mm (3.5 inches)
  • Depth: 891.5 mm (35.1 inches)
  • Width: 488.0 mm (19.3 inches)
  • Weight:
    • Minimum configuration (with one minimal configuration node): 22.4 kg (49.4 lbs)
    • Maximum configuration (with four maximal configuration nodes): 55.0 kg (121.2 lbs)
Acoustical noise emissions With the maximum configuration of four nodes with two processors installed, full memory installed, full drives installed, and two 2000-watt power supplies installed:
  • Operation: 6.8 bels
  • Idle: 6.2 bels
Heat output (based on two 2000-watt power supplies) Approximate heat output:
  • Minimum configuration (with one minimal configuration node): 604.1 BTU per hour (177 watts)
  • Maximum configuration (with four maximal configuration nodes): 7564.4 BTU per hour (2610 watts)
Electrical input
  • Sine-wave input (50-60 Hz) required
  • Input voltage low range: 1100W is limited to 1050W
    • Minimum: 100 V AC
    • Maximum: 127 V AC
  • Input voltage high range: 1100W/1600W/2000W
    • Minimum: 200 V AC
    • Maximum: 240 V AC
  • Input kilovolt-amperes (kVA), approximately:
    • Minimum: 0.153 kVA
    • Maximum: 2.61 kVA
CAUTION:
  1. 240 V dc input (input range: 180-300 V dc) is ONLY supported in Chinese Mainland.

  2. Power supplies with 240 V dc are not hot-swappable. To remove the power cord, ensure you have turned off the server or disconnected the dc power sources at the breaker panel.

  3. In order for the ThinkSystem products to operate error free in both a DC or AC electrical environment, a TN-S earthing system which complies to 60364-1 IEC 2005 standard has to be present or installed.

Minimal configuration for debugging
  • One D2 enclosure
  • One SD530 compute node
  • One processor in processor socket 1
  • One DIMM in slot 6 in the compute node
  • One CFF v3 power supply
  • One drive with hardware/software RAID and backplane (if OS is needed for debugging)

Modular 6U configuration specifications

Table 2. Modular enclosure for 6U configuration specifications
Specification Description
Size Each modular enclosure for 6U configuration is of the following dimension:
  • Height: 87.0 mm (3.5 inches)
  • Depth: 891.5 mm (35.1 inches)
  • Width: 488.0 mm (19.3 inches)
Weight:
  • Minimum configuration (with one minimal configuration node): 67.2 kg (148.2 lbs)
  • Maximum configuration (with four maximal configuration nodes): 165.0 kg (363.6 lbs)
Acoustical noise emissions With the maximum configuration of twelve nodes with two processors installed, full memory installed, full drives installed, and two 2000W power supplies installed:
  • Operation: 6.8 bels
  • Idle: 6.2 bels
Heat output (based on two 2000-Watt power supplies) Approximate heat output:
  • Minimum configuration (with one minimal configuration node): 604.1 BTU per hour (177 watts)
  • Maximum configuration (with four maximal configuration nodes): 7564.4 BTU per hour (2610 watts)