The following information is a summary of the features and specifications of the server. Depending on the model, some features might not be available, or some specifications might not apply.

Table 1. Server Specifications
Specification Description


  • Height: 43.2 mm (1.7 inches)

  • Width: 209 mm (8.2 inches)

  • Depth: 376.1 mm (14.8 inches)

  • Height: 43.2 mm (1.7 inches)

  • Width: 434.4 mm (17.1 inches, from EIA bracket to EIA bracket)

  • Depth: 735.8 mm (29.0 inches)


  • Maximum: 3.6 kg ( 7.9 lbs)

Processor (depending on the model)

One Intel® Xeon® processor D-2100 product family
  1. Use the Setup utility to determine the type and speed of the processors in the node.
  2. For a list of supported processors, see the Lenovo ServerProven website.


  • Slots: 4 DIMM slots

  • Minimum: 8 GB (1 x 8GB RDIMM)

  • Maximum: 256 GB (4 x 64GB LRDIMM)

  • Type:
    • PC4-21300 (single-rank, dual-rank), 2666 MT/s, error correcting code (ECC), double-data-rate 4 (DDR4) registered DIMM (RDIMM)
    • PC4-21300 (quad-rank), 2666 MT/s, error correcting code (ECC), double-data-rate 4 (DDR4) load reduced DIMM (LRDIMM)

Note: For a list of supported processors, see the Lenovo ServerProven website.

M.2 drive

M.2 boot adapter
  • Supports up to two identical M.2 SATA drives

  • Supports three different physical sizes of M.2 drives:
    • 42 mm (2242)

    • 60 mm (2260)

    • 80 mm (2280)

M.2 data adapter
  • PCIe and M.2 riser assembly:

    • Supports up to four M.2 SATA/NVMe drives

  • M.2 riser assembly

    • Supports up to eight M.2 NVMe drives

    • Supports up to four NVMe and four SATA drives

  • Supports four different physical sizes of M.2 drives:
    • 42 mm (2242)

    • 60 mm (2260)

    • 80 mm (2280)

    • 110 mm (22110)

  • M.2 drives installed on boot adapter and on data adapter are not swappable.

  • M.2 connector type: socket 3 (M key)

PCIe riser assembly

PCIe and M.2 riser assembly:

  • Slot 6: PCI Express 3.0 x16, (supports <75W, low profile, half-height, half-length PCIe adapter)


  • WLAN: IEEE 802.11 a/b/g/n/ac

  • MIMO: 2x2 MIMO

  • Interfaces: WLAN: PCIe x1

  • Antenna configuration: 2xIPEX (MHF4) connector

  • Form factor: M.2 2230


  • 3GPP Release 11

  • Category: Cat9

  • Region: Global

  • Operating mode: FDD/TDD

  • Data transmission: 450Mbps DL/50Mbps UL

  • Function interface: USB 3.0

  • Antenna configuration: 2xIPEX (MHF4) connector

  • Form factor: M.2 3024

Integrated functions

  • Lenovo XClarity Controller, which provides service processor control and monitoring functions, video controller, and remote keyboard, video, mouse, and remote drive capabilities.

  • Front operator panel

  • LOM module connector (front of server):

    • 10G SFP+ LOM Package

      • Two USB 3.1 Gen 1 connectors

      • Two 1Gb Ethernet connectors

      • Two Lenovo XClarity Controller network connectors

      • Two 10Gb SFP+ connectors

      • One VGA connector

    • Wireless enabled LOM Package

      • Two USB 3.1 Gen 1 connectors

      • Two 1Gb Ethernet connectors

      • One Lenovo XClarity Controller network connector

      • Two 1Gb SFP connectors

      • Two 10Gb SFP+ connectors

      • One VGA connector

  • Rear I/O connectors (rear of server):

    • Two WLAN Antenna connectors

    • One RS-232 port (RJ-45)

    • Two LTE Antenna connectors

    • Two USB 2.0 connectors

    • Two types of power distribution module:

      • 12V power distribution module (PDM) with two power connectors

      • -48V power distribution module (PDM) with one power connector

RAID controllers

Software RAID: A software RAID controller is integrated on the system board. The software RAID controller supports RAID levels 0, 1, 5, and 10.

  • SED is not supported

  • Software RAID: standard Intel SATA software RAID, RSTe

Video controller (integrated into Lenovo XClarity Controller)

Matrox G200
  • SVGA compatible video controller
  • Avocent Digital Video Compression
  • 16 MB of video memory (not expandable)
Note: Maximum video resolution is 1920 x 1200 at 60 Hz.


Three 40mm system fans

Power adapters

External power adapters:

Sine-wave input (50–60 Hz) required

  • 240W external power adapter

    100-127 V ac / 200-240 V ac, 3.2/1.6 A

  • Power adapters is supported only by 12V PDM

  • It is best practice to use identical power adapters.

Acoustical noise emissions (base configuration)

  • Operation:
    • Minimum: 5.3 bels

    • Typical: 5.4 bels

    • Maximum: 5.7 bels

  • Idle
    • Minimum: 4.9 bels

    • Typical: 5.0 bels

    • Maximum: 5.4 bels

  1. These sound power levels are measured in controlled acoustical environments according to procedures specified by ISO 7779 and are reported in accordance with ISO 9296.

  2. The declared acoustic noise levels are based on specified configurations, which may change slightly depending on configurations/conditions.

  3. The options supported in this server vary in function, power consumption, and required cooling. Any increase in cooling required by these options will increase the fan speed and generated sound level. The actual sound pressure levels measured in your installation depend upon a variety of factors, including: the number of racks in the installation; the size, materials, and configuration of the room; the noise levels of other equipment; the room ambient temperature and barometric pressure; and the location of employees in relation to the equipment.

Heat output

Approximate heat output:
  • Minimum configuration: 287.46 BTU per hour (84.25 watts)
  • Maximum configuration : 783.02 BTU per hour (229.49 watts)

Electrical input

Power distribution module: 12V PDM
  • Supports 12.2V/20A per power adapter

  • Each node supports up to two power adapters

Power distribution module: -48V PDM

  • -48V - -60V DC / 8.4 A max direct -48V input

  • Power redundancy is in dual power mode when system power consumption is under 210W.

  • System operates in capping/throttling mode when power resource is insufficient.

  • Install two power adapters when system power consumption is higher than 210W.


The ThinkSystem SE350 complies with ASHRAE class A4 specifications. System performance may be impacted when operating temperature is outside ASHRAE A4 Specification or fan failed condition outside A2 Specification.
The ThinkSystem SE350 is supported in the following environment:
  • Air temperature:
    • Server on:
      • 0°C to 45°C (32°F to 113°F); decrease the maximum ambient temperature by 1°C for every 125 m (410 ft) increase in altitude above 900 m (2,953 ft).

        Note: For the 1U 2-node model, the temperature limitation is 0°C to 35°C (32°F to 95°F).
    • Sever off: 0°C to 45°C (32°F to 113°F)

    • Shipping/storage: -40 to 60°C (-40 to 140°F)

    • Extended operation temperature (with limited configuration)::

      • Server on: 0°C to 55°C (32°F to 131 °F)

      • Server off: 0°C to 55°C (32°F to 131 °F)

        Note: Limited configuration: no GPU, no Micron/LiteON M.2 SSD drive, only Lenovo certified PCIe Cards.
  • Maximum altitude: 3050 m (10,000 ft)

  • Relative Humidity (non-condensing):
    • Operating: 8% to 90%, maximum dew point : 24°C (75.2°F)

    • Shipment/storage: 8% to 90%, maximum dew point : 27°C (80.6°F)

  • Non-operating (unpacked) storage can pass the following condition: 5% to 95% at 38.7°C (101.7°F) maximum dry-bulb temperature for 48 hrs.

  • Extended operation temperature : 0°C to 55°C (on limited configuration)

    • No GPU

    • No Micron/LITE-ON M.2

    • Only Lenovo certified PCIe cards

  • Particulate contamination:

    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the solution. For information about the limits for particulates and gases, see Particulate contamination.