Specifications

The following information is a summary of the features and specifications of the compute node. Depending on the model, some features might not be available, or some specifications might not apply.

Table 1. Specifications
Specification Description
Size
  • Height: 55.9 mm (2.2 inches)
  • Depth: 507.3 mm (19.9 inches)
  • Width: 217.35 mm (8.5 inches)
Weight Approximately 5.17 kg (11 lbs.) to 6.5 kg (14 lbs), depending on your configuration.
Processor (depending on the model) Processor: Up to two multi-core Intel Xeon Scalable processors.
  • Use the Setup utility to determine the type and speed of the processors in the compute node.

  • Select processor heat sink according to processor TDP and placement in the compute node.

    • If the processor TDP is lower than or equal to 165 watts, select front or rear standard heat sink.

    • If the processor TDP is higher than 165 watts, select front or rear performance heat sink.

      Note: When using Intel Xeon Gold 6334 8c 165W 3.6GHz processor, select performance heat sink.
  • The compute node supports one I/O expansion adapter when installed with one processor, and two I/O expansion adapters when installed with two processors. At least one I/O expansion adapter should be installed in the compute node.

  • EDSFF drive support guide regarding processor:

    • EDSFF drive feature requires installing two processors in the compute node.

    • EDSFF drive feature is not supported when the processor TDP is higher than 220 watts.

    • EDSFF drive feature is not supported when Intel Xeon Gold 6334 8c 165W 3.6GHz processor is installed in the compute node.

For a list of supported processors, see: Lenovo ServerProven website

Memory
  • Minimum: 16 GB
  • Maximum: 2 TB with 3DS RDIMM
  • Type:
    • Error correcting code (ECC), Low-profile (LP) double-data rate (DDR4) RDIMM and 3DS RDIMM (mixing is not supported)

    • Persistent Memory (PMEM)

  • Supports (depending on the model):

    • 16 GB, 32 GB, and 64 GB RDIMM

    • 128 GB 3DS RDIMM

    • 128 GB Persistent Memory (PMEM)

  • Slots: 16 dual inline memory module (DIMM) connectors that support up to:

    • 16 DRAM DIMMs
    • 8 DRAM DIMMs and 8 PMEMs

For a list of supported DIMMs, see: Lenovo ServerProven website

Note:

Do not mix 32GB DRx4 8 bit RDIMM and 32GB DRx8 16 bit RDIMM in PMEM App Direct Mode and Memory Mode.

2.5-inch drive/backplane
  • Supports up to two small form factor (SFF) drive bays. Drive bay can be either SAS/SATA or NVMe/SATA, depending on the model.
  • Supported 2.5-inch drives:
    • Serial Attached SCSI (SAS)/Serial Advanced Technology Attachment (SATA) hot-swap hard disk drives/solid-state drives
    • Non-Volatile Memory Express (NVMe) solid-state drives
EDSFF drive/backplane
  • Supports up to six Enterprise and Datacenter SSD Form Factor (EDSFF) drive bays.
  • EDSFF drive feature supports software RAID.

  • EDSFF drive support guide regarding processor:

    • EDSFF drive feature requires installing two processors in the compute node.

    • EDSFF drive feature is not supported when the processor TDP is higher than 220 watts.

    • EDSFF drive feature is not supported when Intel Xeon Gold 6334 8c 165W 3.6GHz processor is installed in the compute node.

Attention: EDSFF drives requires specific ambient temperature, see the Environment section in the Specification table for more information.
M.2 drive/backplane ThinkSystem M.2 with Mirroring Enablement Kit contains dual M.2 boot adapter that supports up to two identical M.2 drives.
Supports three physical sizes of M.2 SATA drive:
  • 42 mm (2242)

  • 60 mm (2260)

  • 80 mm (2280)

Supports two physical sizes of M.2 NVMe drive:
  • 80 mm (2280)

  • 110 mm (22110)

Note:
ThinkSystem M.2 Enablement Kit contains single M.2 backplane which is only supported in pre-configured models.
RAID adapter
  • RAID 530-4i adapter

  • RAID 930-4i-2GB adapter

Note: Support for intermixing SAS and SATA HDDs and SSDs. Mixing SAS and SATA drives in the same array is not supported. Mixing of HDDs and SSDs in the same array is not supported.
Integrated functions
  • One baseboard management controller (BMC) with integrated VGA controller (XClarity Controller or XCC)
  • Light Path Diagnostics
  • Automatic server restart (ASR)
  • Additional RAID levels supported when an optional RAID controller is installed
  • One external USB 3.2 Gen 1 port
  • Serial over LAN (SOL)
  • Wake on LAN (WOL) when an optional I/O adapter with WOL capability is installed.
Minimum configuration for debugging
  • One processor in processor socket 1

  • One memory module in slot 2

Operating systems Supported and certified operating systems:
  • Ubuntu Server

  • Microsoft Windows Server

  • VMware ESXi

  • Red Hat Enterprise Linux

  • SUSE Linux Enterprise Server

References:
Predictive failure analysis (PFA) alerts
  • Processors
  • Memory
  • Drives
Security Fully compliant with NIST 800-131A. The security cryptography mode set by the managing device (CMM or Lenovo XClarity Administrator) determines the security mode in which the compute node operates.
Environment The ThinkSystem SN550 V2 compute node complies with ASHRAE Class A2 specifications. Depending on the hardware configuration, some models comply with ASHRAE Class A3 specifications. System performance may be impacted when operating temperature is above 35°C or fan failed condition. The Lenovo ThinkSystem SN550 V2 compute node is supported in the following environment:
  • Air temperature:
    • Operating:
      • ASHRAE Class A2: 10°C - 35°C (50°F - 95°F); decrease the maximum ambient temperature by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).
      • ASHRAE Class A3: 5°C - 40°C (41°F - 104°F); decrease the maximum ambient temperature by 1°C for every 175 m (574 ft) increase in altitude above 900 m (2,953 ft).
    • Compute node off: 5°C to 45°C (41°F to 113°F)
    • Shipment: -40°C to 60°C (-40°F to 140°F)
    • Storage: -40°C to 60°C (-40 to 140°F)
  • Maximum altitude: 3,050 m (10,000 ft)
  • Relative Humidity (non-condensing):
    • Operating:
      • ASHRAE Class A2: 8% - 80%, maximum dew point: 21°C (70°F)
      • ASHRAE Class A3: 8% - 85%, maximum dew point: 24°C (75°F)
    • Shipment/Storage: 8% - 90%
  • Depending on the processor TDP, the compute node may support ASHRAE Class A3 or ASHRAE Class A2 specifications:

    • When the TDP of the installed processor is lower than or equal to 165 watt, the compute node complies with ASHRAE Class A3 specifications.

    • When the TDP of the installed processor is lower than 200 watt, the compute node complies with ASHRAE Class A2 specifications.

Particulate contamination
Attention: Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.
Ambient temperature management Adjust ambient temperature when specific components are installed:
  • Keep ambient temperature to 30°C or lower when processors with TDP of 200 watts or higher are installed.

  • Keep ambient temperature to 30°C or lower when Intel Xeon Gold 6334 8c 165W 3.6GHz processor is installed in the compute node.

  • Keep ambient temperature to 25°C or lower when Intel Xeon Gold 6342 24c 230W 2.8GHz processor is installed in the compute node.

  • Keep ambient temperature to 35°C or lower when Persistent Memory (PMEM) are installed.

  • Keep ambient temperature to 25°C or lower when EDSFF drives are installed