Thermal rules

This topic provides thermal rules for the server.

Server models with front drive bays only

This section provides thermal information for server models with front drive bays only.

Front bays Max. Ambient Temp. (at sea level) CPU TDP1 (watts) Heat sink Air baffle Fan type Max. DIMM Qty.
DRAM2 PMEM3
  • 8 x 2.5"

  • 16 x 2.5"

  • 8 x 3.5"

45°C 105–165 2U (Entry) Standard Standard 32 16
45°C 185–205 2U (Standard) Standard Standard 32 16
35°C 220–240 2U (Standard) Standard Standard 32 16
30°C 250–270 T-shape (Performance) Standard Performance 32 16

24 x 2.5"

30°C 105–165 2U (Entry) Standard Standard 32 16
30°C 185–240 2U (Standard) Standard Standard 32 16
30°C 250–270 T-shape (Performance) Standard Performance 32 16

12 x 3.5"

30°C 105–165 2U (Entry) Standard Standard 32 4
30°C 185–240 2U (Standard) Standard Standard 32 4
Note:
  1. The following processors have below exceptions:

    • The Intel Xeon 6334 HCC 165W processor should use the 2U standard heat sink instead of the 2U entry heat sink.

    • The Intel Xeon 8351N XCC 225W processor should follow rules for processors with TDP ranging from 250 watts to 270 watts.

  2. The 256 GB 3DS RDIMMs are supported only in below server models:

    • 8 x 2.5"

    • 16 x 2.5"

    • 8 x 3.5"

  3. When a 256 GB 3DS RDIMM or 512 GB PMEM is installed, the ambient temperature must be limited to 30°C or lower.

Server models with middle/rear drive bays

This section provides thermal information for server models with middle or rear drive bays.

S/S: SAS/SATA; Any: AnyBay; E: entry; S: standard; P: performance; NA: none
Front bays Middle bays Rear bays Max. Ambient Temp. (at sea level) CPU TDP1 (watts) Heat sink Air baffle Fan type Max. DIMM Qty.
DRAM2 PMEM

24 x 2.5" S/S

16 x 2.5" S/S + 8 x Any

NA

4 x 2.5" S/S

30°C 105–165 2U (E) S P 32 16
30°C 185–205 2U (S) S P 32 16

24 x 2.5" Any

8 x 2.5" Any

NA

30°C 105–165 1U (S)

NA

P 32 16
30°C 185–205 T-shape (P)

NA

P 32 16

24 x 2.5" S/S

8 x 2.5" S/S

4 x 2.5" S/S

8 x 2.5" S/S

30°C 105–165 1U (S)

NA

P 32 16
30°C 185–205 T-shape (P)

NA

P 32 16

12 x 3.5" S/S

NA

2 x 3.5" S/S

4 x 2.5" S/S

4 x 3.5" S/S

30°C 105–165 2U (E)

NA

P 32 4
30°C 185–205 2U (S) S P 32 4

8 x 2.5" Any

NA

30°C 105–165 1U (S)

NA

P 32 4
30°C 185–205 T-shape (P)

NA

P 32 4

4 x 3.5" S/S

4 x 2.5" S/S

4 x 3.5" S/S

30°C 105–165 1U (S)

NA

P 32 4
30°C 185–205 T-shape (P)

NA

P 32 4

12 x 3.5" Any

NA

4 x 3.5" S/S

30°C 105–165 2U (E) S P 32  
30°C 185–205 2U (S) S P 32 4

4 x 3.5" S/S

4 x 3.5" S/S

30°C 105–165 1U (S)

NA

P 32 4
30°C 185–205 T-shape (P)

NA

P 32 4
Note:
  1. The Intel Xeon 6334 HCC 165W processor is not included. When this processor is used, middle drive bays or rear drive bays are not supported.

  2. The 256 GB 3DS RDIMMs are not supported.

Server models with GPUs

This section provides thermal information for server models with GPUs.

  • Single-wide GPU (40 W, 75 W): P620, T4, A4

  • Single-wide GPU (150 W): A10

  • Double-wide GPU (165 W, 250 W, 300 W): V100S, A100, A40, A30, A6000, A16

E: entry; S: standard; P: performance

Front bays Max. Ambient Temp. (at sea level) CPU TDP1 (watts) Heat sink Air baffle Fan type Max. GPU Qty. Max. DIMM Qty.
40W, 75W 150W 165W, 250W, 300W DRAM2 PMEM

8 x 2.5"

16 x 2.5"

8 x 3.5"

30°C 105–165 2U (E) S P 8     32 16
30°C 185–205 2U (S) S P 8     32 16
1U (S) GPU P   4   32 16
    3 32 16
30°C 220–270 T-shape (P) S P 8     32 16
GPU P   4   32 16
    3 32 16

24 x 2.5"

30°C3 105–165 2U (E) S P 6     32 4
1U (S) GPU P   4   32 4
    2 32 4
30°C3 185–240 T-shape (P) S P 6     32 4
GPU P   4   32 4
    2 32 4
Note:
  1. The following processors have below exceptions:

    • The Intel Xeon 6334 HCC 165W processor should use the 2U standard heat sink instead of the 2U entry heat sink.

    • The Intel Xeon 8351N XCC 225W processor should follow rules for processors with TDP ranging from 250 watts to 270 watts.

  2. When the 256 GB 3DS RDIMMs are supported only in below server models:

    • 8 x 2.5"

    • 16 x 2.5"

    • 8 x 3.5"

  3. If a NVIDIA V100S adapter is installed, the maximum ambient temperature must be limited to 25°C or lower.